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Jul 15
2009
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Worldwide sales of copper-based carrier Ethernet access platforms rose 42 percent year-over-year to $266 million in the rolling four-quarter period ending in 1Q09. These Copper-based CEAP platforms include Ethernet-over-bonded copper pair (G.shdsl and MIMO on DMT) and Ethernet-over-TDM access circuit solutions.
"Many service providers who collectively spent billions of dollars deploying carrier Ethernet/MPLS-based network infrastructure during 2006-2008 are now increasingly shifting their attention to adding low-cost copper- and fiber-based Ethernet endpoints to their networks," said industry analyst Stan Hubbard. (a Senior Analyst for Ethernet Academy).
"In 1Q09, global E-o-bonded copper pair platform sales grew slightly quarter-over-quarter, while E-o-TDM access circuit and E-o-fiber access platform revenues dipped only modestly on a sequential basis. This stands in sharp contrast to the double-digit sequential revenue declines we saw for carrier Ethernet switches and routers that sit further back in the network."
